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Northfield, MN 55057
Phone: 507-663-7162
Fax: 507-663-1070

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Coverlay is a material applied to the outside layers of the circuit to
insulate the copper conductor. Below are types of coverlays used at All Flex.

Polyimide/Polyester Coverlay:
These materials are normally produced with a drilling process. Limitations to the drilling process enable production of round and oval holes, leaving the inability to have square openings, dense features or any unique shape other than round or oval. Both polyester and polyimide coverlay can be punched or blanked in lieu of the drilling process and is normally done for large coverlay openings.

 
  Via Hole  Covered with coverlay
  Component Hole  .005" (.127mm) minimum per side larger than the copper pad
  Feature Definition  .008" (.20mm) minimum

Note: Coverlay openings can be individual bared
pads or group bared pads depending on area available.

Photoimagable Coverlay & Soldermask (Covercoat):
Both photoimagable coverlay and soldermask are produced by a photo controlled process and are used for tight pad spaces. This process enables unique shapes to be applied anywhere on the circuit. Photoimagable coverlay is usually not used with 2oz. copper or above. Due to the thickness of the copper, photoimagable coverlay and soldermask will not conform around the area of some copper features.

 

  Via Hole  Covered with soldermask
  Component Hole  .003" (.076mm) minimum per side larger than the copper pad
  Feature Definition  .005" (.127mm) minimum
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