Multi-Layer Construction Circuits


Multi-Layer flexible circuits consist of 3-6 copper layers
encapsulated with dielectric, normally connected with a plated thru-hole
(see diagram below). Multi-layer circuits can be fabricated with or
without coverlayers.
When to Use Multi-Layer Flex:
  • Required when circuit density and layout
     cannot be routed on a single layer
  • Ground and power plane applications
  • Used for shielding applications
  • Dense surface mount assembly
  • Increased circuit density
  • EMI/RFI shielding
  • Controlled impedance with shielding

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     Single Sided Circuits  |   Double-Sided Circuits  |   Flexible Heater Circuits
     Maxi Flex®  |   Rigid Flex  |   Multi-Layer Flex Circuits  |   Flexible Printed Circuit
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