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Capabilities and Certifications
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| • Single Sided | Up to 22" x 28" (558.8mm x 711.2mm) |
| • Double Sided | Up to 16" x 22" (406.4mm x 558.8mm) Plated, Nonplated 22" x 28" (558.8mm x 711.2mm) |
| • Multi-Layer | Up to 16" x 22" (406.4mm x 588.8mm) Standard 3-6 Layers (up to 8 layers nonstandard) |
| • Maxi-Flex® | Up to 20" x 40 feet+ (508mm x 12192.0mm) Longer Possible Upon Request |
| • Flexible Heaters | Up to 22" x 28" (558.8mm x 711.2mm) Custom & stock sizes available, for more info visit: www.allflexheaters.com/ |
| • Rigid Flex | Up to 8 Layers 16" x 22" (406.4mm x 588.8mm) |
Hole Size:
| • Non-Plated Thru Holes | .005" (.125mm) min. drilled hole size. Tolerance +/- .0015" (.038mm) |
| • Plated Thru Holes | .005" (.125mm) min. drilled hole size. Tolerance +/- .003" (.076mm) |
Line Width And Spacing:
• .002" Minimum Line
• .002" Minimum Spacing
Conductor to Edge of Circuit/Blanking:
| • Soft Tooling | Outline dimensions +/- .05" (.125mm) |
| • Hard Tooling | Outline dimensions +/- .003" (.0254mm) |
| • ZIF LaserCut Punching | Outline dimensions +/- .002" (.0508mm) with CpK >2.0 |
Drill Position:
• Tolerance of +/- .003" (.076mm)
Layers:
• Up to 6 conductor layers
• Shielding layer -Copper or Silver
• Pads on plating layer
• Flexible PCB
• Automated offers mixed form factor assembly
• Surface mount components down to size 0201
• Vision placement system allows accuracy to .001"
• Fine pitch capability to .5mm pitch
• Tactile domes for integrated switches
• Staked terminals
• Unlimited component configurations
• Thru hole assembly
• RoHS Compliant assembly
• Virtual all SMT components including discretes, SOICs, PLCCs, QPPs, & BGA's
• Auto fiducial correction
• Heat sinks
• Precision stenciling
• Electrical testing
• Folding/forming
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Single Sided Circuits | Double-Sided Circuits | Flexible Heater Circuits
Maxi Flex® | Rigid Flex | Multi-Layer Flex Circuits
