1705 Cannon Lane
Northfield, MN 55057
Phone: 507-663-7162
Fax: 507-663-1070

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Certifications:

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Standard Flexible PCB Manufacturing Capabilities

RoHS Compliant Flex Circuits and Assembly Available

Circuit Sizes:
  • Single SidedUp to 22" x 28" - (558.8mm x 711.2mm)
  • Double SidedUp to 16" x 22" - (406.4mm x 588.8mm)
  • Multi-LayerUp to 12" x 24" - (304.8.4mm x 609.6mm) 3-6 Layers
  • Maxi-Flex®Up to 16" x 40 feet - (254mm x 12192.0mm)
Longer Possible Upon Request

Hole Size:
  • Non-Plated Thru Holes.010" (.25mm) min. drilled hole size. Tolerance +/- .0015" (.038mm)
  • Plated Thru Holes.010" (.25mm) min. drilled hole size. Tolerance +/- .003" (.076mm)
(Smaller holes can be manufactured, contact All Flex sales)

Line Width And Spacing:
  • .005" (.12mm) Minimum Line
  • .005" (.12mm) Minimum Spacing
(Finer lines can be manufactured, contact All Flex sales.)

Conductor to Edge of Circuit/Blanking:
  • Soft ToolingOutline dimensions +/- .010" (.25mm)
  • Hard ToolingOutline dimensions +/- .003" (.076mm)
  • ZIF PunchingOutline dimensions +/- .002" (.0508mm) with CpK >2.0

Drill Position:
  • Tolerance of +/- .003" (.076mm)

Layers:
  • Up to 6 Conductor Layers
  • Shielding Layer - copper and silver
  • Pads on Plating Layer
  • Flexible PCB

Automation Offers Mixed Form Factor Assembly

All Flex Adds Value With Complex Assembly Combinations Including:
  • Surface mount components up to 0204
  • Precise vision system allows placement accuracy to .001"
  • Fine pitch capability to .5mm pitch
  • Leaded devices
  • Tactile domes
  • Staked terminals
  • Unlimited component configurations
  • RoHS Compliant assembly
  • Virtually all SMT components including discretes, SOICs, PLCCs, QPPs, & BGA's
  • Auto fiducial correction

Standard Flexible PCB Materials

Base Materials:
About polyimide film at Dupont
About Rogers Corp
  • Polyimide1/2 mil to 5 mils (.012mm - .127mm)
  • Polyester1 mil to 15 mils (Available with 1 oz. and 2 oz. copper)
  • Adhesiveless
     Materials
Various thicknesses
  • Flame RetardantLaminates and Coverlay
  • PEN(Speak with All Flex staff regarding technical information)
  • LCPVariety of constructions
  • Duroid Material Non plated through hole applications

Base Copper:
  • 1/2 oz. - .0007" (.018mm) thick copper
  • 1 oz. - .0014" (.036mm) thick copper
  • 2 oz. - .0028" (.071mm) thick copper
  • Copper thickness to 0.010"

Solder Mask:
  • Polyimide coverlay: 1/2 mil to 5 mils (.012mm - .127mm)
  • Polyester coverlay: 1 mil to 3 mils (.025mm - .076mm)
  • Soldermask
  • Photoimageable Coverlay

Surface Finish:
  • Hot Air Solder Level (HAL)
  • Tin Plating - electroless and electrolytic (RoHS Compliant)
  • Hard and Soft Gold over Nickel (RoHS Compliant)
  • Nickel (RoHS Compliant)
  • Silver (RoHS Compliant)

Rigidizers/Stiffeners:
  • G10/FR4
  • Aluminum
  • Polyimide
  • Polyester

© Copyright 2007 All Flex, Flexible Circuit Manufacturer