1705 Cannon Lane
Northfield, MN 55057
Phone: 507-663-7162
Fax: 507-663-1070
Home | About Us | Contact Us | Site Map
|
|
1705 Cannon Lane Home | About Us | Contact Us | Site Map |
||
GLOSSARYBREAK ELONGATION – The increase in length of a material, caused by a tensile load, which causes the material to break. COMPARE THERMAL PROPERTY SPECIFICS TO FR4 – FR4 is a NEMA designation for flame retardant epoxy resin woven glass reinforced laminate. This laminate is copper clad for producing “rigid board” printed circuitry. FR4 has glass transmission temperatures ranging from 110º Celsius to 180º Celsius. FR4 is a common stiffener material for flexible printed circuits because it has similar thermal characteristics to polyimide/acrylic/copper clad laminates. DIELECTRIC CONSTANT – The property of a dielectric which determines the electrostatic energy stored per unit volume for a unit potential gradient. DIELECTRIC STRENGTH – The maximum voltage that a dielectric can withstand, under specified conditions, without resulting in a voltage breakdown (usually expressed as volts/unit dimension). DIMENSIONAL STABILITY – A measure of the dimensional change of material that is caused by factors such as temperature changes, humidity changes, chemical treatment (aging) and stress exposure. DISSIPATION FACTOR – A value that represents the tendency of insulating or dielectric materials to absorb some of the energy in an alternating-current signal EDHD VS. H.T.E. COPPER – EDHD copper is electro-deposited high ductility copper designed for flexible circuits where some flexing will occur in use or moderate stress is expected. EDHD is generally less expensive then rolled annealed copper. H.T.E. copper is high temperature elongation copper designed for applications where stress or flexing will occur at elevated temperatures. FATIGUE DUCTILITY – A value of the ductility determined by continuous flexing of copper conductors versus to ductility determined by elongation testing. MOISTURE ABSORPTION – The amount of water the base material will absorb. RESISTIVITY – A material’s opposition to the flow of electric current, measured in ohms. TENSILE STRENGTH – The resistance of a material to a force tending to tear it apart, measured as the maximum tension the material can withstand without tearing. THERMAL RESISTANCE – Resistance to heat. THERMOPLASTIC VS. THERMOLSET – Thermoplastic adhesives are adhesives that become fluid above their glass transition temperatures and can be re-melted repeatedly. Thermoset adhesives are those that cure with cross-linking between the polymer chains and will not re-melt with repeated heating. TIE COAT – Used to improve the bond of copper to polyimide film and provide a barrier to copper oxidation. The “tie coat” is Chrome or Monel sputtered or vapor deposited on to the polyimide film prior to the copper deposition. ULTIMATE ELONGATION – The maximum increase in length of a material prior to breaking. |
