High Density Capability
Fast Quotes Fast Delivery High Quality
All Flex offers custom flexible circuitry within a wide spectrum of product features, including extended lengths, multi-layers, non-traditional material constructions and specialized foils.
The company’s high density capabilities provide customers with the ability to integrate precision flexible circuitry in small packages. Coupled with its fast-turn design and fabrication processes, designers and project managers can obtain high-density flexible circuitry in only 2-3 weeks.
- Fine lines down to 50 microns (.002”)
- Minimum pitch 100 microns (.004”)
- Microvias to 100 microns (.004”) for 2 layer flex
- Precision mask registration
- Component placement sizes down to 0201
- Extended length fine line circuitry
- Optional surface finishes
- Impedance controlled/high speeds
- Shielding
- Adhesiveless or adhesive based laminate
- Thermal dissipative materials
Download our High Density Brochure
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Fine lind polyimide-based flex circuits down to 100 micron pitch (.002"/.002") |
