Multi-Layer Construction Circuits

Multi-Layer flexible circuits consist of 3-6 copper layers
encapsulated with dielectric, normally connected with a plated thru-hole
(see diagram below). Multi-layer circuits can be fabricated with or
without coverlayers.

When to Use Multi-Layer Flex:

  • Required when circuit density and layout cannot be routed on a single layer
  • Ground and power plane applications
  • Used for shielding applications
  • Dense surface mount assembly
  • Increased circuit density
  • EMI/RFI shielding
  • Controlled impedance with shielding



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