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Standard MaterialsBASE MATERIALS:Polyimide: .5 mil to 5 mils (.012mm - .127mm)
BASE COPPER:Polyester: 2 mil to 15 mils (.050mm - .127mm) Adhesiveless Materials: Copper thickness .5 oz. to 2 oz. Flame Retardant: Laminates and Coverlay Other Materials Upon Request .5 oz. - .0007" (.018mm) thick copper
SOLDER MASK:1 oz. - .0014" (.036mm) thick copper 2 oz. - .0028" (.071mm) thick copper 3 oz. - .0042" (.107mm) thick copper 4 oz. - .0056" (.142mm) thick copper 5 oz. - .0070" (.178mm) thick copper 6 oz. - .0084" (.213mm) thick copper 7 oz. - .0098" (.249mm) thick copper Thicker coppers are available (call for information). Polyimide coverlay: .5 mil to 5 mils (.012mm - .127mm)
SURFACE FINISH:Polyester coverlay: 1.5 mil to 3 mils (.076mm - .228mm) Photo-imageable covercoat: Liquid for surface mount and dense applications Hot Air Solder Level (HASL) RoHS Compliant and tin lead
RIGIDIZERS/STIFFENERS:Tin Plating (RoHS Compliant) Elctroless and electrolytic Silver (RoHS Compliant) Immersion Hard Gold over Nickel (RoHS Compliant) (Typically used for contacts) Soft Gold over Nickel (RoHS Compliant) (Electrolytic - typically used for bonding gold wire to the gold layer) ENIG (Electroless Nickel Imersion Gold) (RoHS Compliant) (Electroless - typically used for bonding aluminum wire to the nickel under the gold) Organic Coating OSP (RoHS Compliant) FR4-drilled, routed and scored
CERTIFICATIONS:Aluminum Polyimide Polyester Stainless Steel ISO 9001:2008 Certified
AS9100 Certified MIL-P-50884D Qualified QA 9000 Compliant RoHS Compliant IPC Member: Product is manufactured in accordance with the requirements of IPC-6013 ITAR Registerd JCP Certified UL Certified for individual polyimide layers up to 3 mil (not multi-layers) flexible printed circuitry.
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