High Density Capability

All Flex offers custom flexible circuitry within a wide spectrum of product features, including extended lengths, multi-layers, non-traditional material constructions and specialized foils.

Precision Flexible Circuitry in Small Packages

All Flex’s high density capabilities provide customers with the ability to integrate precision flexible circuitry in small packages. Coupled with its fast-turn design and fabrication processes, designers and project managers can obtain high-density flexible circuitry in only 2-3 weeks.

High Density Capabilities

  • Fine lines down to 50 microns (.002”)
  • Minimum pitch 100 microns (.004”)
  • Microvias to 100 microns (.004”) for 2 layer flex
  • Precision mask registration
  • Component placement sizes down to 0201
  • Extended length fine line circuitry
  • Optional surface finishes
  • Impedance controlled/high speeds
  • Shielding
  • Adhesiveless or adhesive based laminate
  • Thermal dissipative materials

24 Hour Quotes

All Flex will provide a quote within 24 hours.

Design Consultation

Need help? Request a Design Consultation below. 

Design Guide

Download it for free or request a copy.