Assemblies

Through Hole

When to Use
  • Robust connection is required for strain relief and vibration.
  • Military or similar custom connector is required.

SMT Components

When to Use
  • Eliminate the need for a separate circuit board.
  • Shrink the size and weight of your overall device.
  • Exact placement of temperature sensor for responsiveness and accuracy.
Features
  • Tiny sizes, down to size 0105.
  • Place components on both sides of circuit.
  • Complex fine pitch and high density packaging.

Wires

When to Use
  • Heater controller prefers a terminal that is more suited to wires than flexible circuits.
  • Cable harnesses are preferred in the overall device design.
Features
  • Tiny chip sizes, down to size 0105.
  • Place chips on both sides of circuit.
  • Complex fine pitch and high density packaging.

Potting/Conformal

When to Use
  • Ruggedize wire, SMD and heatsink connections.
  • Provide dielectric strength.
  • Eliminate the need for a separate circuit board.
  • Shrink the size and weight of your overall device.
  • Exact placement of temperature sensor for responsiveness and accuracy.
Features
  • Versatile placement (location, thickness).
  • Several options to choose from with different properties and curing methods.
  • Can be robotically applied to control variation.
  • Options include UL approved, NASA outgassing approved, etc.

Testing

When to Use
  • Component-level tests using equipment is correctly selected for flexible circuits and heaters.
  • Performance data is desired.
  • Destructive and nondestructive evidence is desired.
  • Coupon library is desired.
  • Reduce or eliminate incoming tests and device-level testing.
Features
  • All typical electrical and mechanical test needs are supported by dedicated equipment.
  • Part-specific fixtures are designed and built in-house.
  • Specialized tests are supported for IPC, MIL Spec, UL/CSA, NASA/ESA, etc. requirements.
  • Exotic tests are outsourced to approved suppliers.
A series of All Flex circuits being tested