Assemblies
Through Hole
When to Use
- Robust connection is required for strain relief and vibration.
- Military or similar custom connector is required.
SMT Components
When to Use
- Eliminate the need for a separate circuit board.
- Shrink the size and weight of your overall device.
- Exact placement of temperature sensor for responsiveness and accuracy.
Features
- Tiny sizes, down to size 0105.
- Place components on both sides of circuit.
- Complex fine pitch and high density packaging.
Wires
When to Use
- Heater controller prefers a terminal that is more suited to wires than flexible circuits.
- Cable harnesses are preferred in the overall device design.
Features
- Tiny chip sizes, down to size 0105.
- Place chips on both sides of circuit.
- Complex fine pitch and high density packaging.

Potting/Conformal
When to Use
- Ruggedize wire, SMD and heatsink connections.
- Provide dielectric strength.
- Eliminate the need for a separate circuit board.
- Shrink the size and weight of your overall device.
- Exact placement of temperature sensor for responsiveness and accuracy.
Features
- Versatile placement (location, thickness).
- Several options to choose from with different properties and curing methods.
- Can be robotically applied to control variation.
- Options include UL approved, NASA outgassing approved, etc.
Testing
When to Use
- Component-level tests using equipment is correctly selected for flexible circuits and heaters.
- Performance data is desired.
- Destructive and nondestructive evidence is desired.
- Coupon library is desired.
- Reduce or eliminate incoming tests and device-level testing.
Features
- All typical electrical and mechanical test needs are supported by dedicated equipment.
- Part-specific fixtures are designed and built in-house.
- Specialized tests are supported for IPC, MIL Spec, UL/CSA, NASA/ESA, etc. requirements.
- Exotic tests are outsourced to approved suppliers.
