by All Flex | Feb 28, 2020 | Blogs
This article is the third and final part of methods for imaging etches resist. The first part discussed screen printing; the second part discussed traditional photo exposing. The third part discusses laser direct imaging (LDI). The basic process sequence for LDI is...
by All Flex | Feb 28, 2020 | Blogs
While a well-designed flexible circuit will eliminate many connectors, ultimately most flexible circuits need to connect to something. Probably the most common entity that a flex circuit connects to is a rigid printed circuit board, but cable harnesses, polyester...
by All Flex | Feb 28, 2020 | Blogs
Plating copper through holes or vias is a requirement for double sided and multilayer circuits. In a previous blog we discussed the plating process; specifically copper seed coating using electroless copper and shadow® plating, which is then followed with an electro...
by All Flex | Feb 28, 2020 | Blogs
There are many reasons an end user will specify the copper thickness of a printed circuit. The most obvious reason would be for current carrying capacity, but copper thickness also directly impacts thermal performance and impedance. All these are vital properties...
by All Flex | Feb 28, 2020 | Blogs
I heard one of our Applications Engineers describe our product as “making sandwiches”. It is a pretty good metaphor as it helps visualize a cross section of a printed circuit with several layers of dissimilar materials. Most flexible circuits and PCB’s have multiple...
